That’s what I’m hoping for. There are currently ARM chips out there with 80+ cores, and the ability to access terabytes of memory. It’s all high-end server stuff, granted, but it’s possible with the architecture.
I would imagine that heat dissipation (and doing it without excess noise) is the major challenge as far as putting this in the hands of consumers. But one of those big Mac Pro cases could accommodate quite a bit in the way of cooling equipment. 